With the development of semiconductor technology, from evaporation particles to sputtering targets, from advanced 2.5D and 3D packaging to advanced wafer manufacturing and silicon photonics technology, Bonisemi provides the semiconductor industry with the broadest range of evaporation materials and sputtering target solutions, covering all common geometries, sizes and materials for 4-6 inch, 8-12 inch and PLP panel-level packaging.
