Bonis high-purity aluminum sputtering targets are manufactured using advanced casting metallurgical processes, achieving a purity of over 99.999% (5N), with uniform and fine grain size (<100μm) and controllable texture. These products are widely used in PVD sputtering processes such as integrated circuit metallization, TFT electrodes for flat panel displays, and conductive layers for photovoltaic cells.
• Purity grades: 4N, 4N5, 5N (optional)
• Grain size: ≤80μm, ensuring stable sputtering rate
• Density: ≥99.5%, extremely low porosity
• Size range: Maximum diameter 450mm, thickness 3-25mm
• Backplane bonding: Supports multiple bonding methods including In soldering, Sn soldering, and diffusion soldering.
Suitable for metallization layer deposition on 8-inch and 12-inch wafers, covering various alloy systems such as Al, AlSi, and AlCu. It has been verified on mature mass production lines of several major wafer fabs both domestically and internationally, exhibiting long sputtering lifetime and excellent particle contamination control.
Each batch of products comes with a complete Certificate of Account (COA) report, including GDMS elemental analysis, grain metallographic images, dimensional tolerance testing, and sputtering test data. We are ISO 9001 and IATF 16949 quality management system certified.